Semiconductor device structure and method for fabricating the same

ABSTRACT

A semiconductor device structure is provided. The semiconductor device includes a semiconductor substrate, a first device, and a second device. Each of the first and second devices includes a gate extending in a first direction, source/drain regions respectively formed on opposite first and second sides of the gate, dielectric spacers formed respectively on outer sidewalls of the gate on the first side and the second side, and conductive spacers serving contacts to the source/drain regions and formed respectively on outer sidewalls of the respective gate spacers. A second direction from the source/drain region on the first side to the source/drain region on the second side crosses the first direction.

This application is a divisional application of U.S. patent applicationSer. No. 13/003,969 filed Jan. 13, 2011, which is a national stageapplication of PCT Application No. PCT/CN2010/001497, filed on Sep. 27,2010, which claims priority to Chinese Patent Application No.201010242704.1, filed on Jul. 30, 2010. The contents of the priorityapplications are incorporated by reference in their entirety.

FIELD OF INVENTION

The present invention relates to the semiconductor field, and moreparticularly, to a method for fabricating a semiconductor devicestructure and a resultant semiconductor device structure, where contactsare formed in a self-aligned manner.

BACKGROUND

Nowadays, Integrated Circuits (ICs) are increasingly scaled down, andfeature sizes thereof are becoming smaller and smaller and thus areapproaching the theoretical limit of photolithography systems.Therefore, there are typically serious distortions in an image formed ona wafer by a photolithography, that is, Optical Proximity Effects (OPEs)occur. As the photolithography technology is facing more strictrequirements and challenges, there has been proposed the DoublePatterning Technology (DPT) which is able to enhance photolithographyresolutions. In the DPT, a circuit pattern with a high density isdivided into two separate patterns with lower densities, which are thenrespectively printed onto a target wafer.

Hereinafter, the line-and-cut DPT for making the gates in a conventionalsemiconductor device manufacture process is described with reference toFIGS. 1-3.

FIG. 1 shows a part of a layout of devices formed on a wafer. As shownin FIG. 1, a pattern of lines 1001 which is corresponding to the gatepattern to be formed is printed on the wafer by a photo resist coatingand then an exposure through a mask. Here, active regions 1002 on thewafer are also shown. The respective lines of the pattern 1001 areprinted in parallel in a single direction and have the same or similarpitches and critical dimensions.

Next, as shown in FIG. 2, cuts 1003 are formed in the pattern of lines1001 by a further exposure through a cut mask. Thus, in the pattern1001, gate patterns corresponding to different devices are separatedfrom one another.

Finally, an etching is carried out with the photo resist pattern 1001having cuts 1003 formed therein to arrive at gate structurescorresponding to this pattern.

In the above processes, a single exposure for forming gate patterns isdivided into two: one for exposing the pattern of lines 1001, and theother for exposing the cuts 1003. As a result, it is possible to reducethe demand for photolithography and improve the line width control inthe photolithography. Further, it is possible to eliminate manyproximity effects and thus improve the Optical Proximity Correction(OPC). Furthermore, it is able to ensure a good channel quality and thusguarantee a high mobility for carries in the channels.

Besides, as shown in FIG. 3, after the formation of gates 2002 on wafer2001 by etching in the processes described above, it is often desired toform sidewall spacers surrounding the gates. Since there are cuts 1003in the gate patterns, as shown in FIG. 2, the sidewall spacer materialwill enter inside the cuts 1003. Thus, the sidewall spacers ofrespective gate patterns on two opposite ends of a cut 1003 may mergewith each other, resulting in defects such as voids in the cut 1003.

As shown in FIG. 3, after the main bodies of devices are formed, adielectric layer 2003 may also be deposited on the wafer to electricallyisolate the respective devices from one another. Thus, the defects suchas voids in the cuts 1003 as described above will also cause defects inthe formed dielectric layer. Moreover, in order to make contacts to thegates and sources/drains, contact holes corresponding to the gates andsources/drains may be etched in the dielectric layer 2003, andconductive materials such as metals may be filled therein, so as to formcontacts 2004.

In this case, all the contacts, including those on the sources/drainsand those on the gates, are manufactured by etching the contact holes totheir bottoms at one time and then filling the contact holes withconductive materials. This makes a strict demand for the etching of thecontact holes, For example, since the etching depth on the gate isdifferent from that on the source/drain, a short is likely to occurbetween the gate and the contact hole. Further, since the etching on thesource/drain is deeper while the corresponding opening is relativelysmall (that is, the width to height ratio is small), various problems,such as under-etching, generating voids in the filled metals, and thelike, are likely to occur, This restricts the selection of manufactureprocesses and causes greater parasitic resistances as well.

In view of the above, there is a need for a novel semiconductor devicestructure and a method for fabricating the same.

SUMMARY OF THE INVENTION

It is an object of the present invention to provide a semiconductordevice structure and a method for fabricating the same, to overcome theproblems in the prior art as described above, and especially, tosimplify the formation of contacts.

According to an aspect of the present invention, there is provided amethod for fabricating a semiconductor device structure, comprising:forming gate lines on a semiconductor substrate; forming gate sidewallspacers surrounding the gate lines; forming respective source/drainregions in the semiconductor substrate and on either sides of the gatelines; forming conductive sidewall spacers surrounding the gate sidewallspacers; and cutting off the gate lines, the gate sidewall spacers andthe conductive sidewall spacers at predetermined positions, wherein thecut gate lines result in electrically isolated gates, and the cutconductive sidewall spacers result in electrically isolated lowercontacts.

Preferably, the step of cutting off the gate lines, the gate sidewallspacers and the conductive sidewall spacers comprises: the cutting isperformed by reactive ion etching or laser cutting. In the direction ofgate width, the distance between adjacent electrically isolated gates is1-10 nm and the distance between adjacent electrically isolated lowercontacts is 1-10 nm.

Alternatively, if there are shallow trench isolations formed in thesemiconductor substrate, the positions of cuts are located above theshallow trench isolations.

Preferably, the step of cutting off the gate lines, the gate sidewallspacers and the conductive sidewall spacers is performed after theconductive sidewall spacers are formed and before the front end of lineprocess for the semiconductor device structure is completed.

According to an embodiment of the present invention, after or before thestep of cutting off the gate lines, the gate sidewall spacers and theconductive sidewall spacers, the method further comprises: planarizingthe semiconductor device structure to expose the top of the conductivesidewall spacers or the lower contacts.

Based on the above solution, preferably, after the conductive sidewallspacers are formed and before the cutting is performed, the methodfurther comprises: removing the gate lines so as to form openings insidethe gate sidewall spacers; and forming replacement gate lines in theopenings. Alternatively, before the replacement gate lines are formed,the method further comprises: forming a gate dielectric layer in theopenings.

Based on the above solution, preferably, the cutting is performedimmediately after the conductive sidewall spacers are formed, so as toform the electrically isolated gates and the electrically isolated lowercontacts; and the method further comprises: removing the gates so as toform openings inside the gate sidewall spacers. And the method furthercomprises: forming a gate dielectric layer in the openings.

After the gate lines, the gate sidewall spacers and the conductivesidewall spacers are cut off, the method further comprises: forming aninter-layer dielectric layer on the semiconductor device structure; andforming upper contacts corresponding to the gates and the lower contactsin the inter-layer dielectric layer, wherein the lower contacts face theupper contacts,

According to another aspect of the invention, there is provided asemiconductor device structure, comprising: a semiconductor substrate;at least two transistor structures formed on the semiconductor substrateand arranged along the direction of gate width, each of which comprises:a gate stack formed on the semiconductor substrate, the gate stackincluding a gate dielectric layer and a gate on the gate dielectriclayer; gate sidewall spacers formed only on the lateral surfaces of thegate stack; and lower contacts abutting against the lateral surfaces ofthe gate sidewall spacers, wherein in the direction of gate width, foradjacent transistors, tops of the gates, tops of the gate sidewallspacers and tops of the lower contacts are flush with each other.

Preferably, in the direction of gate width, the distance betweenadjacent transistors is 1-10 nm, and the distance between adjacent lowercontacts is 1-10 nm. Further, in the direction of gate width, therespective gates are isolated with one another by a dielectric material,and the respective lower contacts are isolated with one another by thedielectric material.

Preferably, the lower contacts and the gate stacks have the same height.The lower contacts serve as conductive contacts between the outside andsource/drain regions of the respective semiconductor devices.Preferably, there are upper contacts formed on the gates and the lowercontacts, wherein the upper contacts face the lower contacts.

Unlike the prior art where contacts are formed by etching contact holesand then filling conductive materials in the contact holes, the contactsaccording to embodiments of the present invention are fabricated in theform of sidewall spacers, thereby eliminating the difficulty in formingcontact holes as in the prior art. Further, since the lower contactsaccording to embodiments of the present invention are manufactured inthe form of sidewall spacers which are on both sides of a gate sidewallspacer, they are self-aligned to the source/drain regions and thereforecan serve as contacts for electrical connections between thesource/drain regions of the semiconductor devices and the outside.

Further, in the present invention, the conductive sidewall spacers (thatis, the lower contacts) and the gate stacks may be made to the sameheight by planarization. This facilitates subsequent processes.

Furthermore, in the present invention, the cut for isolating differentdevices from one another is carried out after the formation of gatesidewall spacers and conductive sidewall spacers. Therefore, there willbe no sidewall spacer material remained in the cuts and thus no defectssuch as voids as in the prior art. In addition, the conductive sidewallspacers (that is, the contacts) of different devices are completelyseparated by the cuts, and thus the devices are electrically isolatedfrom one another.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other objects, features, and advantages of the presentinvention will be more apparent by describing embodiments thereof indetail with reference to the attached drawings, wherein:

FIGS. 1-3 shows a schematic flow of fabricating a semiconductor devicestructure according to the prior art;

FIGS. 4-10 are schematic diagrams showing device structures during thefabrication of a semiconductor device structure according to a firstembodiment of the present invention; and

FIGS. 11-15 are schematic diagrams showing device structures during thefabrication of a semiconductor device structure according to a secondembodiment of the present invention.

DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS

Hereinafter, the present invention is described with reference toembodiments shown in the attached drawings. However, it is understoodthat these descriptions are illustrative and not intended to limit thepresent invention. Further, in the following, well-known structures andtechniques are not described to avoid obscuring the concept of thepresent invention.

In the drawings, various layer-structures according to embodiments ofthe present invention are shown. However, they are not drawn to scale,and some features may be enlarged while some features may be omitted forpurposes of clarity. Moreover, the shapes, sizes, and relative positionsof the regions and layers shown in the drawings are also illustrative,and deviations may occur due to manufacture tolerances and techniquelimitations in practice. Those skilled in the art can also deviseregions/layers of other different shapes, sizes, and relative positionsas needed,

A First Embodiment

Hereinafter, a first embodiment of the present invention is describedwith reference to FIGS. 4-10.

FIG. 4 shows a part of a layout formed on a semiconductor substrate.Here, the semiconductor substrate may comprise any suitablesemiconductor substrate materials, for example, but not limited to, Si,Ge, SiGe, SOI (Silicon on Insulator), SiC, GaAs, or any III-V groupcompound semiconductor, etc. According to known design requirements (forexample, for a p-type substrate or an n-type substrate) in the priorart, the semiconductor substrate 1000 may comprise various dopingconfigurations. Further, the semiconductor substrate 1000 may optionallycomprise an epitaxial layer which may be manipulated by stress forperformance enhancement.

In the semiconductor substrate, Shallow Trench Isolations (STIs) 3001have already been formed, and active regions 3002 are formed in theareas surrounded by STI structures 3001. For of convenience, FIG. 4 onlyshows strip-like active regions 3002 and strip-like STI structures 3001.As to the formations of STI structures and active regions, a referencemay be made to existing conventional techniques, and the presentinvention is not limited thereto.

Optionally, a gate dielectric layer 3003 (shown in FIG. 6, but not shownin FIG. 4) may be formed on the semiconductor substrate before theformation of a gate material layer. The gate dielectric layer maycomprise, for example, ordinary dielectric materials, such as SiO₂, orhigh-k dielectric materials, such as one or more materials selected fromHfO₂, HfSiO, HfSiON, HfTaO, HfTiO, HfZrO, Al₂O₃, La₂O₃, ZrO₂, LaAlO, orother materials.

As shown in FIG. 4, a gate material layer is deposited on thesemiconductor substrate (or optionally, the gate material layer isdeposited on a gate dielectric layer 3003, not shown here). A pattern oflines 3004 which corresponds to the pattern of gate lines to be formedis printed by a photo resist coating and then an exposure through a maskfollowed by a development. The lines of the pattern 3004 are printed inparallel in a single direction and have the same or similar pitches andcritical sizes.

In contrary to the prior art, after the pattern of lines 3004 is formed,a pattern of cuts is not immediately formed using a cut mask. Instead,the gate material layer deposited on the wafer is etched directly usingthe pattern of lines 3004, so as to form parallel gate lines 3005′, asshown in FIG. 5.

After the gate lines 3005′ are formed, conventional processes may beconducted in order to fabricate semiconductor devices such astransistors. For example, processes such as ion implantation (to performdoping so as to form, for example, sources/drains), sidewall spacerformation, silicidation, and dual stress liner integration may becarried out, which will be described in detail in the following.

Specifically, as shown in FIG. 6A, gate sidewall spacers 3006 are formedsurrounding the gate lines 3005′ (in the drawings, no sidewall spacer isshown on the upper or lower ends of a gate line, but in an actualprocess, the gate sidewall spacers 3006 are surrounding the gate lines3005′). For example, the gate sidewall spacers 3006 may be formed bydepositing on the entire semiconductor device structure one or morelayers of dielectric materials, such as SiO₂, Si₃N₄, SiON, or othermaterials, or any combination thereof, and then conducting a ReactiveIon Etching (RIE, to selectively etch the dielectric materials withrespect to Si) thereon.

After the sidewall spacers 3006 are formed, it is possible to carry outan etching along the sidewall spacers to remove the gate dielectriclayer 3003 located outside the sidewall spacers.

Further, source/drain regions 3007 may be formed beside the respectivegates in the substrate 3000 by ion implantation doping. Optionally,before the gate sidewall spacers are formed, source/drain extensionregions and Halo regions (not shown) may be formed by tilted ionimplantations.

Optionally, the source/drain regions 3007 and the gate lines 3005′ maybe subjected to silicidation to form a metal silicide layer 3008. Thesilicide may be formed by; depositing a metal layer, such as W, Co, andNi, on the entire semiconductor device structure; conducting anneal at ahigh temperature to make the semiconductor material (Si in thisembodiment) react with the metal so as to form the silidice; and finallyremoving the unreacted metal. FIG. 6B shows a part of a section viewtaken along the arrows shown in FIG. 6A, where only two gate stacks areshown for convenience.

Here, it should be noted that the above processes (such as ionimplantation, sidewall spacer formation, and silicidation) forfabricating the semiconductor devices are not directly relevant to thesubject matter of the invention, and thus will not be described indetail here. They may be implemented by conventional processes or byfuture developed processes, and the present invention is not limitedthereto.

Next, as shown in FIG. 7A, conductive sidewall spacers 3009 may beformed by surrounding the gate sidewall spacers 3006 described abovewith conductive materials, such as W, TiN, TaN, Al, TiAl, Co, or othermaterials (in the drawings, again no conductive sidewall spacer is shownon the upper or lower ends of the gate lines, but in actual, theconductive sidewall spacers 3009 are surrounding the gate sidewallspacers). The conductive sidewall spacers 3009 may be made, for example,as follows. A conductive material layer is conformally deposited on thesubstrate (wafer). Then, the deposited conductive material layer isselectively etched to remove the portions parallel to the substrate(wafer) surface, leaving only portions perpendicular to the substrate(wafer) surface. Thereby, the conductive sidewall spacers 3009 areformed. Obviously, those skilled in the art can recognize other ways formanufacturing the conductive sidewall spacers 3009 as well as the abovedescribed gate sidewall spacers 3006.

FIG. 7B shows a part of a section view taken along the arrows shown inFIG. 7A, where only two gate stacks are shown for convenience. As shownin FIG. 7B, the conductive sidewall spacers 3009 formed by the methoddescribed above are self-aligned on the source/drain regions 3007 of thesemiconductor device, and thus may serve as lower contacts forelectrical connections between the source/drain regions and the outside.

Subsequently, as shown in FIG. 8A, the gate lines 3005′, together withthe surrounding gate sidewall spacers 3006 and the surroundingconductive sidewall spacers 3009, are cut off at predetermined positionsaccording to the design, to achieve electrical isolation between therespective gates and thus achieve electrical isolation between therespective devices. In general, the cuts are made above the STIs 3001,with a cut width of about 1-10 nm. The cutting may be implemented, forexample, by RIE, a laser cutting etch, etc. with the use of a cut mask.For instance, if the cutting is done by an etching, a photo resist maybe coated on the substrate (wafer) and then patterned by the cut mask sothat predetermined regions corresponding to the cuts to be formed areexposed. Then, the exposed portions of the gate lines 3005′ as well astheir surrounding sidewall spacers 3006 and surrounding conductivesidewall spacers 3009 are cut off, so as to form the cuts 3010. As aresult, the cut gate lines 3005 result in electrically isolated gates3011, and the cut conductive sidewall spacers 3009′ result inelectrically isolated contacts 3012. Here, the cuts 3010 are positionedabove the STIs 3001.

FIG. 8B shows a part of a section view taken along the arrows shown inFIG. 8A, where only two gate stacks are shown for convenience. As shownin FIG. 8B, an inter-layer dielectric layer 3013 may be formed on theentire semiconductor device structure. The inter-layer dielectric layer3013 also fills up the cuts 3010 formed by the above cutting process, sothat the gates 3011 are isolated from the lower contacts 3012.

According to another embodiment of the present invention, it is feasibleto form the inter-layer dielectric layer 3013 before cutting the gatelines, the gate sidewall spacers and the conductive sidewall spacers. Itis also capable of accomplishing the present invention,

Finally, referring to FIGS. 9A and 9B, a semiconductor device accordingto one embodiment of the present invention is shown, wherein FIG. 9A isa top view and FIG. 9B shows a part of a section view taken along thearrows shown in FIG. 9A, where only two gate stacks are shown forconvenience. As shown in FIG. 9, the semiconductor device comprises aplurality of transistor structures formed on a semiconductor substrate,and there are at least two arranged in the gate width direction (thatis, the vertical direction in FIG. 9A, and the direction perpendicularto the sheet in FIG. 9B). Each of the transistor structures comprises: agate stack formed on the semiconductor substrate, the gate stackcomprising a gate dielectric layer 3003 and a gate 3011 on the gatedielectric layer; gate sidewall spacers 3006 formed only on the lateralsurfaces of the gate stack (there is no gate sidewall spacer on theupper or lower ends of the gate stack due to the cutting process); andcontacts 3012 abutting against the lateral surfaces of the gate sidewallspacers 3006. Here, in the gate width direction, for adjacenttransistors, ends of the gates 3011, ends of the gate sidewall spacers3014, and ends of the lower contacts 3012 are flushed with each other.

On both sides of the gates 3011, there are the source/drain regions 3007and also the metal silicides 3008 on the source/drain regions 3007.

Preferably, in the direction of gate width, for adjacent devices, thedistance between the gates 3011 and the distance between the lowercontacts 3012 are 1-10 nm.

Preferably, in the direction of gate width, the respective gates 3011are isolated from one another by dielectric materials (for example, theinter-layer dielectric layer 3013), and so are the respective lowercontacts 3012.

Preferably, according to an embodiment of the present invention, thelower contacts 3012 have the same height the gate stacks and serve asconductive contacts between the source/drain regions of thesemiconductor devices and the outside.

To obtain a completed device, it is needed to form upper contacts forthe gates and the source/drain regions. In this case, the devices needto be further polished. As shown in FIG. 9, the entire semiconductordevice structure may be subjected to a Chemical Mechanical Polishing(CMP) process untill the top of the lower contacts 3012 is exposed. InFIG. 9, it is shown that the CMP process also removes the silicide layeron the top of the gate stacks. However, in practice, the silicide layermay remain on the top of the gate stacks.

Next, as shown in FIG. 10, a further inter-layer dielectric layer 3014is deposited on the entire semiconductor device structure and thenpolished by a CMP process. Then, upper contacts 3015 are formed on thegates 3011 and on the lower contacts 3012 for the source/drain regions3007. On the source/drain regions 3007, the lower contacts 3012 arealigned with the upper contacts 3015 so that electrical contacts areachieved.

A Second Embodiment

The method according to the present invention is also compatible withthe replacement gate process. Hereinafter, a second embodiment of thepresent invention is described with reference to FIGS. 11-15, where thereplacement gate process in incorporated in this embodiment. The secondembodiment differs from the first embodiment mainly in that: areplacement gate process is conducted after the source/drain regions areformed. Specifically, dummy gate lines are firstly formed and then arereplaced with replacement gate lines. The same or similar referencenumbers in the drawings and in the first embodiment denote correspondingparts.

In the following, emphasis is given to the differences of the secondembodiment from the first embodiment and description of the sameprocesses is omitted. Like reference numbers denote like partsthroughout the drawings.

As shown in FIG. 11A, dummy gate lines 3005′ are formed by printing apattern of parallel gate lines and then carrying out an etching, whichis the same as in the first embodiment. Usually, the dummy gate lines3005′ are made of poly silicon. Then, the process continues asconventional to form the semiconductor device structure. For example,source/drain regions 3007 may be formed into the semiconductor substrateat both sides of the respective dummy gate lines 3005′, gate sidewallspacers 3006 may be formed to surround the dummy gate lines 3005′, and ametal silicide layer 3008 may be formed on the source/drain regions3007. Here, a pattern of active regions 3002 on the semiconductorsubstrate is also shown.

FIG. 11B shows a part of a section view taken along the arrows shown inFIG. 11A, where only two gate stacks are shown for convenience. As shownin FIG. 11B, in this embodiment, the dummy gate lines 3005′ are made ofpoly silicon and thus have no metal silicide layer thereon.

Next, as shown in FIGS. 12A and 12B, conductive sidewall spacers 3009are formed to surround the gate sidewall spacers 3006. The conductivesidewall spacers 3009 are self-aligned with the source/drain regions ofthe semiconductor devices and thus can serve as contacts for electricalconnections between the source/drain regions and the outside.

Optionally, as shown in FIG. 12B, after the formation of conductivesidewall spacers 3009, an inter-layer dielectric layer 3013 between thedevices may be formed (for example, deposited) on the semiconductorsubstrate and then be planarized. For example, the inter-layerdielectric layer may be a stress nitride layer.

Subsequently, a replacement gate process may be conducted. As shown inFIG. 13, the dummy gate lines 3005′ are removed by, for example, anetching, so as to form an opening 3016 between a pair of gate sidewallspacers 3006.

Next, as shown in FIG. 14, replacement gate lines 3005′ are formed inthe openings 3016. If a gate dielectric layer is not formed on thesemiconductor substrate in advance, a gate dielectric layer 3003, forexample, a high-k dielectric layer, may be formed in the openings beforethe formation of replacement gate lines. After that, the replacementgate lines 3005′ are formed. Those skilled in the art can conceivevarious ways to implement such a gate line replacement process.

Alternatively, the replacement gate process may be conducted beforeforming the inter-layer dielectric layer 3013.

Preferably, a planarization process, for example, CMP, may be performedafter the formation of replacement gate lines 3005′, so as to make thereplacement gate lines 3005′ have the same height as the conductivesidewall spacers 3009, which will facilitate subsequent processes.

Then, referring to the process described with reference to FIG. 8, thegate stacks 3005′, the gate sidewall spacers 3006, and the conductivesidewall spacers 3009 are cut off at predetermined positions by using acut mask, so as to achieve electrical isolation between devices. Afterthe cutting process, cuts 3010 are formed in the gate stacks 3005′, thegate sidewall spacers 3006, and the conductive sidewall spacers 3009.The cut gate lines 3005′ result in gates 3011, and the cut conductivesidewall spacers 3009 result in lower contacts 3012. The lower contacts3012 can serve as a portion of contacts for the source/drain regions.

To complete the front end of line (FEOL) process, it is necessary tofurther fabricate complete contacts. As shown in FIG. 15, a furtherinter-layer dielectric layer 3014 is deposited on the inter-layerdielectric layer 3013, and upper contacts 3015 are formed therein. Onthe gate stacks, the upper contacts 3015 correspond to and in contactwith the gates 3011. On the source/drain regions, the upper contacts3015 correspond to and in contact with the lower contacts 3012.Therefore, the contacts to the gate regions and the source/drain regionsare realized. If there are some unfilled gaps in the cuts 3010, theywill be further filled up after depositing the further inter-layerdielectric layer 3014. Thus, the gates 3011 arranged in the gate widthdirection can be further electrically isolated, and the lower contacts3012 arranged in the gate width direction can also be furtherelectrically isolated, In this embodiment, it is clear from FIG. 15that, in the forming of upper contacts 3015, the etching depths of theupper contacts on the gate regions and the source/drain regions are thesame. Thus, it is possible to simplify the etching process.

Here, it should be noted that, although the replacement gate process isconducted before the cutting process in the above described embodiment,the present invention is not limited to it. It is also feasible toconduct the cutting process before the replacement gate process. Forexample, the dummy gate lines 3005″ may be cut off immediately after theconductive sidewall spacers 3009 are formed so as to form electricallyisolated gates 3011 and electrically isolated contacts 3012. Then, thereplacement gate process is conducted to form the replacement gates. Ina word, the sequences of the steps in various embodiments of the presentinvention are not limited to those described in the above embodiment.

According to embodiments of the present invention, the cutting of thegate lines, the gate sidewall spacers, and the conductive sidewallspacers may be performed anytime after the conductive sidewall spacersare formed, so as to finally complete the FEOL process for thesemiconductor device structure.

The gate sidewall spacers and the conductive sidewall spacers shown inFIGS. 11-15 are all in a shape of “I”, which are different from those ina shape of “D” in the first embodiment. The “I” shaped sidewall spacershave a benefit that they have the same height as the gate stacks so thata CMP polishing as shown in FIG. 10 is unnecessary before concurrentlyforming the upper contacts on the gates and the source/drain regions.Thus, the cost can be reduced. In the following, a method for forming“I” shaped sidewall spacers is explained, taking a formation of ordinarygate sidewall spacers for an example. A method for forming normal gatesidewall spacers may be as follows: firstly, a very thin protectivelayer of dielectric material, such as SiO₂, is formed on the entiresemiconductor device structure; then, a thicker layer of dielectricmaterial, such as Si₃N₄, is formed, with a thickness of about 40-50 nm;and finally, the Si₃N₄ layer is selectively etched by RIE so as to formgate sidewall spacers surrounding the gates. In contrary, in forming “I”shaped sidewall spacers, after the thicker dielectric layer is formed, afurther very thin layer of dielectric material, which may also be SiO₂,is formed on the thicker dielectric layer, with a thickness of about 3nm. Then, the uppermost layer of SiO₂ is subjected to RIE so as to forma very thin protective layer for Si₃N₄ conformal to the respectivegates. Next, the Si₃N₄ layer is further selectively etched. Since theportion of the Si₃N₄ layer adjacent to the gate are protected by theSiO₂ protective layer, the Si₃N₄ layer will not suffer from laterallosses, resulting in an “I” shaped sidewall spacer.

In the case where the l shaped sidewall spacers are formed, it ispossible to not perform CMP polishing, and it is also possible todirectly deposit the dielectric layer 3014 without depositing thedielectric layer 3013 and then form upper contacts in the dielectriclayer 3014. Such processes are also capable of accomplishing the presentinvention.

As described above, according to embodiments of the present invention,the pattern of parallel gate lines, after being printed on the substrate(wafer), will not be cut off immediately by using a cut mask as in theprior art. In contrary, the pattern of parallel gate lines is directlyused in gate lines etching. Subsequently, processes for forming thesemiconductor device structure are performed. Then, by surrounding thegates, more specifically, by surrounding the gate sidewall spacers,contacts to source/drain are formed in a self-aligned manner in a formof sidewall spacer. Finally, the gates and the contacts in a form ofsidewall spacer are both cut off by using a cut mask, so as to achieveelectrical isolation between devices.

Therefore, according to the present invention, the gate pattern is cutoff at a later stage so that the ends of a pair of opposing gates can becloser to each other. Further, in the present invention, the cuttingprocess is conducted to isolate the devices from one another after theformation of gate sidewall spacers and conductive sidewall spacers.Therefore, there will be no sidewall spacer materials remained in thecuts, and there will be no defects, such as voids, as in a conventionalprocess. In addition, the conductive sidewall spacers (that is, thecontacts) for respective devices are entirely cut off by the cuts, andthus it is possible to achieve good electrical isolation between thedevices.

Further, unlike the prior art where contacts are formed by etchingcontact holes and then filling the contact holes with conductivematerials, according to embodiments of the invention, the contacts areformed in a form of sidewall spacer, thus eliminating the difficulty informing contact holes in the prior art. Also, such contacts in a form ofsidewall spacer are self-aligned on the source/drain regions, andtherefore the process is dramatically simplified. At the same time, itis impossible to form such self-aligned contacts in a form of conductivesidewall spacer according to conventional processes.

This is because in conventional processes, the sidewall spacer formationprocess is conducted after the cuts are formed. In this case, during theformation of sidewall spacers, especially, during the forming ofconductive sidewall spacers, conductive materials may enter into thecuts. This will possibly cause the respective conductive sidewallspacers of a pair of opposing gates not to be completely isolated fromeach other, and thus the corresponding devices will electrically contactwith each other.

Furthermore, the present invention is compatible with a replacement gateprocess. Thus, it is possible to have various options for process.

Moreover, in the present invention, the conductive sidewall spacers(that is, the contacts) and the gate stacks may be made to have the sameheight by, for example, a planarization process. This facilitates thesubsequent processes.

In the above description, details of patterning and etching of thelayers are not described. It is understood by those skilled in the artthat various measures in the prior art may be utilized to form thelayers and regions in desired shapes. Further, to achieve the samefeature, those skilled in the art can devise processes not entirely thesame as those described above.

Although the disclosure has been described with respect to only alimited number of embodiments, those skilled in the art, having benefitof this disclosure, will appreciate that various other embodiments maybe devised without departing from the scope of the present invention.Accordingly, the scope of the invention should be limited only by theattached claims.

1.-20. (canceled)
 21. A semiconductor device structure, comprising: asemiconductor substrate; a first device and a second device, each of thedevices comprising: a gate extending in a first direction; source/drainregions respectively formed on opposite first and second sides of thegate, wherein a second direction from the source/drain region on thefirst side to the source/drain region an the second side crosses thefirst direction; dielectric spacers formed respectively on outersidewalls of the gate on the first side and the second side; andconductive spacers serving contacts to the source/drain regions andformed respectively on outer sidewalls of the respective gate spacers,wherein the first device and the second device are adjacent to eachother in the first direction, their respective gates align to each otherand extend in a substantially straight line along the first direction,their respective dielectric spacers align to each other and extend in asubstantially straight line along the first direction, and theirrespective conductive spacers align to each other and extend in asubstantially straight line along the first direction, wherein an endsurface of the gate of the first device facing the second device and endsurfaces of the conductive spacers of the first device facing the seconddevice are substantially flush with each other, and wherein thesemiconductor device structure further comprises inter-device electricalisolation provided between the first device and the second device. 22.The semiconductor structure of claim 21, wherein an end surface of thegate of the second device facing the first device and end surfaces ofthe conductive spacers of the second device facing the first device aresubstantially flush with each other.
 23. The semiconductor structure ofclaim 21, wherein each of the dielectric spacers of the first devicedoes not extend onto the end face of the gate of the first device facingthe second device.
 24. The semiconductor structure of claim 22, whereineach of the dielectric spacers of the second device does not extend ontothe end face of the gate of the second device facing the first device.25. The semiconductor structure of claim 21, wherein each of thedielectric spacers of the first and second devices is in a straight-lineshape.
 26. The semiconductor structure of claim 21, wherein thedielectric spacers of the first device respectively on the first andsecond sides are physically disconnected from each other.
 27. Thesemiconductor structure of claim 22, wherein the dielectric spacers ofthe second device respectively on the first and second sides arephysically disconnected from each other.
 28. The semiconductor devicestructure of claim 21, wherein the inter-device electrical isolation islocated above shallow trench isolation formed in the semiconductorsubstrate.
 29. A semiconductor device structure, comprising: asemiconductor substrate; a first device and a second device, each of thedevices comprising: a gate having opposite first and second sidewallsand also opposite third and fourth sidewalls; source/drain regionsrespectively formed on opposite sides of the gate; dielectric spacersformed respectively on the first and second sidewalls of the gate;conductive spacers serving contacts to the source/drain regions andformed respectively on sidewalls of the respective dielectric spacersfacing away from the gate, wherein the first device and the seconddevice face each other with one of their respective third or fourthsidewalls, wherein the dielectric spacer of the first device on thefirst sidewall thereof and the dielectric spacer of the second device onthe first sidewall thereof extend only on a plane defined by therespective first sidewalls of the first and second devices, and thedielectric spacer of the first device on the second sidewall thereof andthe dielectric spacer of the second device on the second sidewallthereof extend only on a plane defined by the respective secondsidewalls of the first and second devices, and wherein the semiconductordevice structure further comprises inter-device electrical isolationbetween the first device and the second device.
 30. The semiconductordevice structure, wherein the inter-device electric isolation comprisesa substantially uniform dielectric material formed between andcontiguous to the facing third or fourth sidewalls of the first andsecond devices.